发明名称 |
MANUFACTURING METHOD OF FERROELECTRIC MEMORY ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a ferroelectric memory element wherein the upper surface of an upper electrode is made a smooth surface by preventing columnar residue from being formed in formation of the upper electrode. SOLUTION: A lower electrode Ir layer 36, a ferroelectric film [SrBi<SB>2</SB>Ta<SB>2</SB>O<SB>9</SB>(SBT)] 38 and an Ir layer 40a for upper electrode formation are formed on a foundation one by one. An etching resistant mask TiN film 42a for upper electrode formation is formed on the upper surface of the Ir layer 40a and a first dry etching process is carried out. A ferroelectric memory element is formed by removing the etching resistant mask TiN film 42a in a third dry etching process after a second dry etching process for removing deposit sticking on the etching resistant mask TiN film 42a by the first dry etching. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004241692(A) |
申请公布日期 |
2004.08.26 |
申请号 |
JP20030030840 |
申请日期 |
2003.02.07 |
申请人 |
OKI ELECTRIC IND CO LTD;SONY CORP |
发明人 |
MIHASHI TOSHIRO;GODAIIN HIRONORI |
分类号 |
H01L21/3065;H01L21/8246;H01L27/105;(IPC1-7):H01L27/105;H01L21/306 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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