FILM CARRIER TAPE FOR PACKAGING ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a film carrier tape for packaging an electronic component capable of preventing a disconnection of wire occurs by an internal stress before and after a semiconductor chip is packaged, and to provide its manufacturing method. SOLUTION: The film carrier tape 10 for packaging an electronic component has a wiring pattern 13 comprising an insulating layer 11 and a conductive layer 12 formed on the surface of the layer 11, and a conductive wire 102 with its one end connected to the electronic component 100 packaged on the pattern 13 and the other end bonded to the pattern 13. The layer 12 comprises a copper foil having an elongation percentage of not less than 9% at room temperature or at 180°C. Forming a nickel plating layer 19 having a thickness of not less than 0.4μm on the part of the pattern 13 to which the other end of the wire 102 is bonded can prevent the disconnection of the pattern 13 and improves a reliability of the line for packaging the semiconductor chip. COPYRIGHT: (C)2004,JPO&NCIPI