POWER SEMICONDUCTOR MODULE PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A power semiconductor module package is provided to improve a heat radiating characteristic and remarkably reduce fabricating cost by using a dummy lead capable of aligning and fixing a DBC(direct bonded copper) substrate and a leadframe. CONSTITUTION: The DBC substrate(250) is prepared. The leadframe is coupled to the DBC substrate. The dummy lead is connected to the DBC substrate and the leadframe to align and fix the DBC substrate and the leadframe. A part of the DBC substrate and the rest of the leadframe except the outer lead of the leadframe are covered with EMC(epoxy molding compound).