| 摘要 |
PROBLEM TO BE SOLVED: To prevent adhesion of fused substances to the circumference by momentarily vaporizing the fused substances generated at the processing portion of a work. SOLUTION: The apparatus is provided with an XY table 2 for mounting a wafer 1, a drive mechanism 3 for driving the XY table 2, a laser oscillator 6 for irradiating the wafer 1 with a laser beam 5, and a controller 4 for controlling the drive mechanism 3 and the laser oscillator 6. The apparatus is also provided with a liquid drop supplying means 10 for supplying drops 9a of liquid 9 to the processing portion 1a to be irradiated with the laser beam 5 for vaporizing the fused substances of the wafer 1. COPYRIGHT: (C)2004,JPO&NCIPI |
