| 摘要 |
PURPOSE: An epoxy point adhesive for mounting integrated circuit package, its preparation method and a mounting method of electronic parts using the adhesive are provided, to reduce thermal impact and to prevent the generation of smell of lead welding by omitting temporal lead welding process. CONSTITUTION: The epoxy point adhesive comprises 100 parts by weight an epoxy resin, 10-60 parts by weight of a potential curing agent, 2-15 parts by weight of an inorganic filler, 6-30 parts by weight of a thixotroping agent and 0.1-3 parts by weight a pigment, wherein the epoxy resin is a bisphenol A-type resin having a viscosity of 7,000-20,000 cps at 25 deg.C, an epoxy equivalence of 170-240 g/eq and a Cl content of 1,000 ppm or less, a bisphenol F-type resin having a viscosity of 1,000-10,000 cps at 25 deg.C, an epoxy equivalence of 140-200 g/eq and a Cl content of 200 ppm or less, or their mixture; and the potential curing agent is at least one selected from the group consisting of dicyandiamide-based, imidazole-based and amine-based curing agents. The adhesive does not use a solvent.
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