| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device whose heat generation in switching-on is reduced by decreasing contact resistance when bus-bars for external connection and electrodes of the semiconductor device are connected electrically, whose size is reduced by reducing size of nuts for electrical connection, and to which the nuts are attached without wrong fitting. SOLUTION: The bus-bars 6 for external connection are connected with pressure to the electrodes 8 for external output by driving bolts 12 into the nuts 2 whose both end faces, at least peripheries of them, are not chamfered. COPYRIGHT: (C)2004,JPO&NCIPI |
