| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that electrical connection between a through-hole conductor and a terminal pad conductor easily breaks out due to cracks which are generated at the joint surface or the like of a via conductor by the expansion and contraction of a core substrate during a process of a thermal cycle, in a wiring board made of resin. SOLUTION: In the wiring board made of resin 1, stacked wiring layers made of conductor layers and resin layers 3 are accumulated on the main surface of the core substrate 2 which includes an approximately cylindrical through-hole conductor 22 in a through-hole 21 penetrating in the direction of thickness and a filling material 23 in its hollow. A lid-like conductor 24 which covers at least the end surface of the through-hole and is connected to the through-hole conductor and a terminal pad conductor 4 which is formed on the main surface of the stacked wiring layer in order to make a connecting terminal 5 for connection with an external instrument are prepared on the main surface of the core substrate of the wiring substrate 1. A joint part 7 embedded in the resin layer, made of a via conductor, connects the lid-like conductor 24 and the terminal pad conductor 4. The via conductor of the joint part is not placed on the central axis 211 of the through-hole. COPYRIGHT: (C)2005,JPO&NCIPI |
