| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing having characteristics having good adhesiveness and excellent in solder crack resistance and a semiconductor device. SOLUTION: The epoxy resin composition for semiconductor sealing comprises (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) an organopolysiloxane having a specific structure containing a monovalent organic group having a 1-40C carboxy group as essential components, and the component E is contained in an amount of 0.01-5 wt.% based on total epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
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