发明名称 EDGE COVER APPARATUS OF PLASMA PROCESS APPARATUS TO ELIMINATE TRI-LAYER PARTICLES FORMED ON SUBSTRATE
摘要 PURPOSE: An edge cover apparatus of a plasma process apparatus is provided to eliminate tri-layer particles formed on a substrate by making an edge bolt and a distribution plate covered with a cover apparatus having a predetermined thermal expansion coefficient and by preventing a tri layer from being peeled. CONSTITUTION: A reaction gas part supplies reaction gas to vacuum chamber. A heater is installed in the vacuum chamber. An electrode box is so disposed to confront the heater. An Al plate applies electrical power, connected to the electrode box. A distribution plate distributes the reaction gas to the inside of the vacuum chamber, attached to the Al plate. An edge bolt connects the distribution plate with the Al plate. The edge bolt and the distribution plate are covered with an insulating cover plate(100) disposed on the edge bolt and the distribution plate such that the insulating cover plate has a thermal expansion coefficient smaller than that of the edge ball and the distribution plate. The cover plate is reinforced by a reinforcement plate(101) made of a stainless material such that the reinforcement plate is coupled to the cover plate.
申请公布号 KR100457497(B1) 申请公布日期 2004.11.08
申请号 KR19970019715 申请日期 1997.05.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG, JIN HO
分类号 H01L21/3065;(IPC1-7):H01L21/306 主分类号 H01L21/3065
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