发明名称 |
Method of laser machining materials with minimal thermal loading |
摘要 |
A method of controlling thermal loading of an electronic component material during ablation thereof provides a first laser light beam 42 at a certain power density and fluence and uses the first laser light beam to remove a portion of a first side 47 of the material 36. A second laser light beam 44 is provided at a certain power density and fluence and the second laser light beam is used to remove a portion of a side 49 of the material opposing the first side thereof substantially simultaneously as the portion of the first side is being removed.
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申请公布号 |
US6821472(B2) |
申请公布日期 |
2004.11.23 |
申请号 |
US20020120029 |
申请日期 |
2002.04.10 |
申请人 |
SIEMENS DEMATIC ELECTRONICS ASSEMBLY SYSTEMS, INC. |
发明人 |
SCHREINER ALEXANDER F.;HOFMANN NEAL |
分类号 |
B23K26/36;H05K3/00;(IPC1-7):B23K26/38 |
主分类号 |
B23K26/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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