| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and method for investigating a thermal image to detect faults, such as voids in vias, e.g., TSV.SOLUTION: A controlled amount of heat is injected into a stacked die using a light beam, and the propagated heat is measured with LIT camera from the other side of the die. The thermal image obtained can be characterized such that it can be used to calibrate the phase shift from a given stack layer or can be used to identify defects in the stacked die. The process can be repeated for each die in the stack to generate a reference for future testing.SELECTED DRAWING: Figure 1 |
