发明名称 METHOD AND APPARATUS FOR INSPECTING SURFACE
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for inspecting a surface, which can easily determine whether defects in an irradiation field of the surface to be inspected are composed of a plurality of minute defects or a large single defect. SOLUTION: The apparatus is provided with an LD 10 which emits laser light L0; an irradiation optical system 20 which enables the emitted laser light L0 to enter the surface to be inspected 210 of a wafer 200 at a prescribed depression angleα; a scanning means 30 which moves the wafer 200 so that the surface to be inspected 210 is spirally scanned with the laser light L0; a light intensity detecting means 50 which detects light intensity; and a scattered light detecting optical system 40 guiding scattered light L2, which is emitted from the irradiation field 220 the laser light L0 enters, to the light intensity detecting means 50. The light intensity detecting means 50 has a multi-anode PMT 51 which resolves the scattered light L2 into ten channels (ch) to detect it in one-dimensional direction (Y axis direction). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005003447(A) 申请公布日期 2005.01.06
申请号 JP20030165458 申请日期 2003.06.10
申请人 TOPCON CORP 发明人 MIYAGAWA KAZUHIRO;IWA YOICHIRO;SEKINE AKIHIKO
分类号 G01N21/956;G01N21/47;G01N21/88;G01N21/94;G01N21/95;H01L21/66;(IPC1-7):G01N21/956 主分类号 G01N21/956
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