发明名称 Bonding LED Die to Lead Frame Strips
摘要 In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.
申请公布号 US2016329473(A1) 申请公布日期 2016.11.10
申请号 US201414901705 申请日期 2014.06.18
申请人 KONINKLIJKE PHILIPS N.V. 发明人 Lee Sze Kuang;Martin Paul Scott;Kraus Albrecht Johannes;Kang Chunheng;Pan Hui Ling;Yin Long
分类号 H01L33/62;H01L33/56;H01L25/075 主分类号 H01L33/62
代理机构 代理人
主权项 1. A light emitting structure comprising: a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip; a plurality of first light emitting diode (LED) dies, each of the first LED dies having a first electrode and a second electrode, wherein the first electrode of the first LED dies is electrically and thermally coupled to a top surface of the first strip; a plurality of second LED dies, each of the second LED dies having a third electrode and a fourth electrode, wherein the third electrode of the second LED dies is electrically and thermally coupled to a top surface of the second strip; the second electrode of the first LED dies being wire bonded to the second strip, and the fourth electrode of the second LED dies being wire bonded to the third strip, to cause the first LED dies to be connected in series with the second LED dies; and a single-piece, first optically transmissive enclosure molded over a first set of the first LED dies and over a second set of the second LED dies, the first optically transmissive enclosure also being molded around the plurality of lead frame strips to mechanically connect the lead frame strips together; a single-piece, second optically transmissive enclosure molded over a third set of the first LED dies and over a fourth set of the second LED dies, the second optically transmissive enclosure also being molded around the plurality of lead frame strips to mechanically connect the lead frame strips together, where there is a gap between the first optically transmissive enclosure and the second optically transmissive enclosure to allow bending of the lead frame strips within the gap, at least one of the first strip, the second strip and the third strip being configured to be electrically coupled to a power source to supply a current through the first LED dies and the second LED dies; a housing of a module enclosing the first LED dies, the second LED dies, the optically transmissive enclosure, and the metal lead frame strips, wherein the plurality of lead fram strips are secured together by at least the first optically transmissive enclosure and the second optically transmissive enclosure and bent in a permanent configuration at the gap between the first optically transmissive enclosure and the second optically transmissive enclosure, such that the arrangement of LEDs is fixed within the housing, to form the module having a predetermined light emission profile determined by the fixed arrangement of LEDs in the module.
地址 Eindhoven NL