发明名称 |
HIGH-SIDE FIELD EFFECT TRANSISTOR |
摘要 |
The present invention provides a transistor comprising a substrate having a surface; a first deep well region in the substrate; a second deep well region in the substrate, isolated from and encircling the first deep well region; a first well region in the substrate and on the first deep well region; two second well regions in the second deep well region and respectively at two opposite sides of the first well region; a source region in the first well region and adjacent to the surface; two drain regions in the two second well regions respectively and adjacent to the surface; two gate structures on the surface, wherein each of the two gate structures is between the source region and one of the drain regions respectively; and a guard ring in the substrate encircling the second deep well region, and on the periphery of the transistor. |
申请公布号 |
US2016329408(A1) |
申请公布日期 |
2016.11.10 |
申请号 |
US201514706002 |
申请日期 |
2015.05.07 |
申请人 |
UNITED MICROELECTRONICS CORPORATION |
发明人 |
CHEN YEN-MING;LEE CHIULING;TSAI MIN-HSUAN;CHEN ZHENG HONG;CHANG WEI HSUAN;LIU TSENG-HSUN |
分类号 |
H01L29/423 |
主分类号 |
H01L29/423 |
代理机构 |
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代理人 |
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主权项 |
1. A high-side field effect transistor, comprising:
a substrate having a surface; a first deep well region disposed in the substrate; a second deep well region disposed in the substrate, separated from and encircling the first deep well region; a first well region disposed in the substrate and on the first deep well region; two second well regions disposed in the second deep well region and respectively at two opposite sides of the first well region; a source region disposed in the first well region and adjacent to the surface of the substrate; two drain regions disposed in the two second well regions respectively and adjacent to the surface of the substrate; two gate structures disposed on the surface of the substrate, wherein each of the two gate structures is disposed between the source region and one of the drain regions respectively; and a guard ring disposed in the substrate encircling the second deep well region, and on the periphery of the high-side field effect transistor. |
地址 |
HSINCHU TW |