ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

摘要

An electronic package is provided, which includes: a circuit structure having opposite first and second sides; at least an electronic element disposed on the first side of the circuit structure; an encapsulant formed on the first side of the circuit structure for encapsulating the electronic element; a dielectric layer formed on portions of the second side of the circuit structure; and a metal structure formed on the dielectric layer and the circuit structure. The metal structure has a first metal layer bonded to the circuit structure and a second metal layer formed on the first metal layer and the dielectric layer. Therefore, by replacing a conventional silicon interposer with the circuit structure, the invention eliminates the need to fabricate through silicon vias so as to greatly reduce the fabrication difficulty and cost. The invention further provides a method for fabricating the electronic package.

主权项

1. An electronic package, comprising:
a circuit structure having a first side and a second side opposite to the first side; at least an electronic element disposed on the first side of the circuit structure; an encapsulant formed on the first side of the circuit structure for encapsulating the electronic element; a dielectric layer formed on the second side of the circuit structure and exposing portions of the second side of the circuit structure; and a metal structure formed on the dielectric layer and the exposed portions of the second side of the circuit structure, wherein the metal structure comprises a first metal layer bonded to the circuit structure and a second metal layer formed on the first metal layer and the dielectric layer.