| 摘要 |
PROBLEM TO BE SOLVED: To realize accurate alignment and improve precision in die bonding even when a semiconductor chip or a base plate inclines. SOLUTION: In manufacturing the semiconductor device, a probe is made to advance between the semiconductor chip and the base plate which are made to counter in a bonding position, and alignment of the semiconductor chip and the base plate is performed by performing image recognition of recognizing points formed on the semiconductor chip and the base plate. When the probe is moved in the horizontal direction, and image recognition of a plurality of the recognizing points formed on the semiconductor chip and the base plate is performed. When the base plate and the chip incline, the probe is moved in the Z direction according to position variation in Z direction of recognizing points which is caused by the inclination of the chip or the base plate, in the recognition points separated in the inclination direction. According to the above-mentioned means, also when the chip or the base plate inclines, image recognition of the recognizing points is realized in the focal depth of the probe, so that alignment with high precision is realized. COPYRIGHT: (C)2005,JPO&NCIPI
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