DEVICE FOR MANUFACTURING CIRCUIT FORMING BOARD

摘要

PROBLEM TO BE SOLVED: To improve the filling properties of a paste composition in a hole in a high-density substrate. SOLUTION: The viscosity of the paste composition is stabilized, to improve the filling properties of the paste composition in a penetrated hole or a non-penetration hole, by providing a hole formation process for boring the penetrated hole or the non-penetrated hole in a planar or sheet-like substrate material and a filling process provided with a filling means for filling the penetration hole or the non-penetrated hole formed in the hole formation process with the paste composition and by adding an additional past composition to the paste composition using the paste addition means in the filling process. COPYRIGHT: (C)2005,JPO&NCIPI