WAFER, INTEGRATED CIRCUIT CHIP, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wafer and an integrated circuit chip by which individual information of the wafer and the integrated circuit chip is easily acquired. SOLUTION: Microchips 1 which communicate an individual identification information are formed on a wafer 2. The microchips 1 are formed on each IC chip 3. These microchips 1 are formed by an identical wafer process, by which the individual identification information of the wafer 2 or the IC chip 3 is easily acquired. Moreover, it is prevented that a portion where the individual identification information is written is lost by a dropout or the like is prevented, for the microchips 1 are formed by the identical wafer process. COPYRIGHT: (C)2005,JPO&NCIPI