| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that transmission characteristic is largely deteriorated because impedance of an input/output pad becomes lower when the radio frequency electrical signal is transmitted. SOLUTION: The package comprises a base material 1 including a mounting portion 1a to mount a semiconductor element 6 for transmitting and receiving the radio frequency electrical signal, a plurality of ground wiring conductors 2b and a first wiring conductor 2a which are guided to the lower surface from the mounting portion 1a of the base material 1, a plurality of grounding pads 3b and input/output pad 3a which are formed in the lower surface of the base material 1 and are electrically connected to the ground wiring conductors 2b and first wiring conductor 2a, a second wiring conductor 4 which is guided to the upper surface or the side surface from the mounting portion 1a of the base material 1, a conductive wire material 5a, and an insulating external housing 5b. The wire material 5a includes a connector 5 electrically connected to the second wiring conductor 4. The input/output pad 3a is formed in the center region of the lower surface of the base material 1 in the flat area of 0.196 mm<SP>2</SP>or less, and the ground pad 3b is formed in the external circumference region of the lower surface of the base material 1 in the flat area of 0.785 mm<SP>2</SP>or more. Moreover, the input/output pad 3a is formed on the top surface of the projected area 9 in the thickness of 0.4 mm to 0.6 mm provided at the lower surface of the base material 1. COPYRIGHT: (C)2005,JPO&NCIPI |
