| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing silicon curved surface bodies used as a material of a curved surface semiconductor or the like, in a simple process and at a low cost, and to provide the silicon curved surface bodies having excellent performance, a device equipped with the silicon curved surface bodies, and a method for manufacturing the device. SOLUTION: The method for manufacturing the silicon curved surface bodies, characterized by using a liquid material containing a silane compound, is provided. The silicon curved surface bodies formed by the method for manufacturing the silicon curved surface bodies and the device using, as a material, the silicon curved surface bodies are provided. Further, the method for manufacturing the device, characterized by using the method for manufacturing the silicon curved surface bodies, is provided. COPYRIGHT: (C)2005,JPO&NCIPI |
