| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus which can connect rigidly a shield cover to a multilayer wiring substrate and which has excellent productivity. SOLUTION: The electronic apparatus mounts the shield cover 2 to the multilayer wiring substrate 1 by exposing ground wiring 5 to side face of the multilayer wiring substrate 1. Connecting legs 2b are stood via a predetermined interval to the exposed part of the ground wiring 5 at parallel two sides of four sides for constituting outer periphery of the shield cover 2, and pressure contact legs 2c are also stood for holding the multilayer wiring substrate 1 brought into pressure contact with the side faces of the multilayer wiring substrate 1 of the residual two sides. The connecting legs 2b and the wiring 5 are electrically connected to the exposed parts of the ground through a conductive adhesive 6. COPYRIGHT: (C)2005,JPO&NCIPI |
