| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent a developer solution from remaining on a wafer while avoiding the defects related to conventional technologies. SOLUTION: A wafer provided with an exposure photoresist is arranged in a reactive space provided for a developing process. The surface of wafer is coated with a developer solution, and the wafer is rotated. The upper and lower surfaces of the wafer are cleaned, and cleaning of the upper surface of the wafer is stopped for a specified period while the lower surface is continued to be cleaned. The wafer provided with the exposure photoresist is disposed on the chuck of a coating equipment, and the surface of wafer is coated with the developer solution. The wafer is rotated to degas the coating equipment so that a water wall is formed between the wafer and the outer wall of a groove. The upper and lower surfaces of the wafer are cleaned by a nozzle, and cleaning of the upper surface of the wafer is stopped for a specified period while cleaning of the lower surface is continued, thus the contamination remaining on the lower surface of the wafer is removed. COPYRIGHT: (C)2005,JPO&NCIPI |
