发明名称 |
Adhesive polyimide resin and adhesive laminate |
摘要 |
An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250□C and a Young's modulus (storage modulus) at 250□C of 10<SUP>5 </SUP>Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270□C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts. |
申请公布号 |
US6887580(B2) |
申请公布日期 |
2005.05.03 |
申请号 |
US20020182402 |
申请日期 |
2002.07.30 |
申请人 |
NIPPON STEEL CHEMICAL CO., LTD. |
发明人 |
TOKUHISA KIWAMU;TOKUMITSU AKIRA;KANEKO KAZUAKI |
分类号 |
B32B15/08;B32B27/34;C08G73/10;C08G77/455;C09J179/08;C09J183/10;H01L21/58;H01L23/498;H05K1/03;H05K3/46;(IPC1-7):C08G73/10;B32B27/00 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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