METHOD OF MANUFACTURING JOINED SUBSTRATE BODY, JOINED SUBSTRATE BODY, ELECTROOPTIC DEVICE, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a joined substrate body capable of improving the quality of the manufactured joined substrate body by improving the arrangement accuracy of a bonding material used to transfer electronic elements. SOLUTION: The bonding material 25b for bonding the electronic elements 24 and wiring 22 is arranged in a pattern by a lithography method. COPYRIGHT: (C)2005,JPO&NCIPI