| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation plate capable of efficiently dissipating the heat generated from a driver integrated circuit (IC) of a plasma display system. SOLUTION: The plasma display system encloses the driver IC 23 in the state that a heat conduction medium 41 is housed in a housing groove 36 of the heat dissipation plate 32 and therefore the heat dissipation is also carried out from the side faces of the housing groove 36 with respect to the heat conduction medium 41. As a result, the contact area of the heat dissipation plate 32 increases and thermal conductivity of the heat conduction medium 41 improves and consequently the temperature rise of the driver IC 23 is suppressed. Also, the heat dissipation area is increased and the heat dissipation efficiency is improved by a projecting part 38. Further, the heat conduction medium 41 is in the form of liquid or gel and therefore the formation of air layers at the boundary of the heat conduction medium 41 with the heat dissipation plate 32 and the driver IC 23 is averted and consequently the heat dissipation efficiency of the driver IC 23 can be further improved. COPYRIGHT: (C)2005,JPO&NCIPI
|
