| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor laser which is superior in heat dissipation properties. SOLUTION: A laser diode bar 11 composed of a plurality of elements that are arranged in parallel is pinched between a first heatsink 12 and a second heatsink 13 to assemble a semiconductor laser. The ends of the laser diode bar 11 are held by securing jigs 18, and then the laser diode bar 11, and the heatsinks 12 and 13 are aligned relative to each other. Thereafter, the laser diode 11 and the heat sinks 12 and 13 are heated simultaneously and are fixed together by pressure. Then, parts of the laser diode bar 11, protruding from the heatsinks 12 and 13, are cut off so as to make the laser diode bar 11 match with the width of the heatsinks 12 and 13. The laser diode bar 11 and the heatsinks 12 and 13 hardly get out of position, the curved part of the laser diode bar 11 is corrected, and the two bond surfaces can be made substantially in parallel with each other and improved in adhesion to each other. COPYRIGHT: (C)2005,JPO&NCIPI
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