| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board wherein the number of steps can be reduced and a substrate with high density can be formed at a low cost. SOLUTION: The printed wiring board comprises at least one or more insulating layers, two circuit conductor layers formed on both surfaces of the insulating layer, and a via hole filled with an electroless plating metal to connect the two circuit conductor layers with each other. In this case, at least one circuit conductor layer is partly formed by a sputtering method. COPYRIGHT: (C)2005,JPO&NCIPI |
