| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability and to provide an electronic device and methods of manufacturing them. SOLUTION: The semiconductor device includes a substrate 10 having a wiring pattern 20 including a plurality of lands 22, and a semiconductor chip 30 having a plurality of electrodes 32 and mounted on the substrate 10 so that the electrodes 32 are opposed to the lands 22. The plurality of the lands 22 are arranged so as to be divided into a plurality of first groups 110 along a plurality of parallel first straight lines 310 to form a profile which is enlarged in a direction along the first straight line 310. The plurality of the electrodes 32 are arranged so as to be divided into a plurality of second groups 130 along the plurality of parallel second straight lines 330 to form a profile which is enlarged in a direction crossed with the second straight line 330. The lands 22 and the electrodes 32 are electrically connected by overlapping so that the longitudinal directions are crossed. COPYRIGHT: (C)2005,JPO&NCIPI |
