发明名称 COOLING DEVICE FOR ELECTRICAL EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To cool a plurality of electrical equipment by the quantity of a cooling corresponding to a calorific value. SOLUTION: Semiconductor elements 800 to 850 represent the semiconductor elements obtained by molding IGBTs constituting an inverter for a motor and diodes. The semiconductor elements 800 to 850 are mounted so as to be abutted against first coolers 1100 to 1106. The semiconductor elements 860 to 910 represent the semiconductor elements obtained by molding the IGBTs constituting the inverter for a generator and the diodes. The semiconductor elements 860 to 910 are mounted so as to be abutted against the first cooler 1106 and second coolers 1200 to 1204. The calorific values of the semiconductor elements 800 to 850 are larger than those of the semiconductor elements 860 to 910. The flow rates of cooling water flowing through the first coolers 1100 to 1106 are more than those of cooling water flowing through the second coolers 1200 to 1204. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005191082(A) 申请公布日期 2005.07.14
申请号 JP20030427550 申请日期 2003.12.24
申请人 TOYOTA MOTOR CORP;DENSO CORP 发明人 KUNO HIROMICHI;TORII TAKASHI
分类号 F25D17/02;H01L23/473;H05K7/14;H05K7/20;(IPC1-7):H05K7/20 主分类号 F25D17/02
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