| 摘要 |
PROBLEM TO BE SOLVED: To provide a low cost semiconductor device having a satisfactory insulation in the vicinity of an electrode of a semiconductor chip, and to provide its manufacturing method. SOLUTION: The semiconductor device comprises a semiconductor chip 1 with a plurality of electrodes 2 provided; an insulating film 4 having a plurality of conductive patterns 5 connected to the electrode 2; and a bump 6 comprising a solder filled in a hole 4a provided in the insulating film 4 and connected to the conductive pattern 5. An insulating film 3 having an insulating film removing part 3a is provided beneath the undersurface of the semiconductor chip 1, and the insulating film 4 is provided beneath the undersurface of the semiconductor chip 1 with the conductive pattern 5 positioned in the insulating film removing part 3a. An intervenient of the insulating film 3 between the conductive patterns 5 positioned and adjacent each other in the vicinity of at least the electrode 2 steadily insulates between the thicken electrodes 2 or between the conductive patterns 5 positioned in the vicinity of it to be able to provide a high quality semiconductor device. COPYRIGHT: (C)2005,JPO&NCIPI
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