| 摘要 |
An optical or EMI shield construction (10, 20, 30, 50, 62) comprises either an optically transmissive substrate (12, 54) adapted for channeling light therethrough, or a dielectric substrate (65), an optional adhesion-promoting layer (18, 56, 66) comprising an oxide form of at least one metal or metalloid deposited onto the surface of the substrate, a layer composed of a highly reflective (14, 58) and/or electrically conductive (68) /electromagnetic metal overlaying the adhesion promoting layer (18, 56, 66), and a protective layer (16, 60, 70) composed of a parylene polymer film (17, 19) formed over the metal layer (14). |
