| 摘要 |
PROBLEM TO BE SOLVED: To surely detect whether a wafer, which is divided along scheduled separation lines formed in the shape of lattice on the surface, is separated or not. SOLUTION: The wafer separation detecting method detects whether a wafer 10 divided along a plurality of scheduled separation lines 101 formed in the shape of lattice on the surface is separated or not along the scheduled separation lines 101. This method comprises a tape adhering process for adhering the wafer 10 to the surface of the extendable dicing tape 16 which is loaded to an annular dicing frame 15; a tape extending process to extend the dicing tape 16 to which the wafer 10 is adhered; a light irradiating process for irradiating one surface of the wafer 10 with the light; and a separation detecting process for detecting whether the light is leaked from the scheduled dividing line 101 at the other surface side of the wafer 10, deciding that the wafer 10 is separated along the scheduled dividing line 101 when the light is leaked, and deciding that the non-separating region exists when the light is not leaked. COPYRIGHT: (C)2005,JPO&NCIPI |
