发明名称 MOLD FOR MOLDING RESIN
摘要 PROBLEM TO BE SOLVED: To provide a mold for molding a resin constituted so as to reduce the thin resin flash formed to a cull part resin body. SOLUTION: The mold for molding resin is equipped with a pot part 8 for housing a fluidized resin to be injected in a cavity and a plunger 10 for extruding the resin heated and fluidized in the pot part 8. The plunger 10 has an annular recessed part 12, which extends in the peripheral direction of the mold to prevent a predetermined amount on above the heated and fluidized resin from flowing in the gap between the outer peripheral surface of the plunger 10, and the inner peripheral surface of the pot part 8, formed to its outer peripheral surface and an annular cavity 13, which is formed by depressing the outer peripheral surface from the leading end on the side of the cavity to the part on this side of the annular recessed part 12 with respect to the inner peripheral surface of the pot part 8, formed thereto. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005246615(A) 申请公布日期 2005.09.15
申请号 JP20040055905 申请日期 2004.03.01
申请人 SHARP TAKAYA DENSHI KOGYO KK 发明人 ITO SADANORI
分类号 B29C45/26;B29C45/02;B29C45/14;B29K105/22;B29L9/00;H01L21/56;(IPC1-7):B29C45/26 主分类号 B29C45/26
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