| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic circuit device in which radiation capabilities of BGA type electronic parts can be increased by utilizing the high radiation capability of a metal core circuit board. SOLUTION: The electronic circuit device comprises a first circuit board 10 mounting the BGA type electronic parts 16 and the metal core circuit board having a circuit layer composed of an insulating layer and a conductive layer on a metal plate. The electronic circuit device includes a circuit layer open part 38 which is disposed facing a surface on which the BGA type electronic parts 16 of the first circuit board 10 are mounted, and in which the metal plate is used as the surface of the metal core circuit board in a portion opposing to the BGA type electronic parts 16. There are provided a second circuit substrate 30 electrically connected to the first circuit board 10, and a heat conduction layer 52 composed of a filler having higher heat conductivity than air in a gap between the BGA type electronic parts 16 and the circuit layer open part 38. COPYRIGHT: (C)2005,JPO&NCIPI |
