| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed circuit-dedicated laminate processable at low temperature in a short cycle time, highly elastic and absorbing less vibration, suitable for use with a low-resistance ultrasonic mounting technology. SOLUTION: The printed circuit-dedicated laminate having a conductor layer and an insulating resin layer is a laminate for ultrasonic bonding, wherein the resin constituting the insulating resin layer has a modulus of elasticity of≥3×10<SP>9</SP>Pa in the range of 23-100°C but not the tanδpeak in the 23-100°C range. The laminate preferably consists of an insulating resin layer, made only of polyimide, and a copper foil layer. COPYRIGHT: (C)2006,JPO&NCIPI |
