发明名称 Semiconductor Package with Integrated Magnetic Field Sensor
摘要 A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway. The magnetic field sensor includes a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction. The magnetic field sensor also includes a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.
申请公布号 US2016380181(A1) 申请公布日期 2016.12.29
申请号 US201514947649 申请日期 2015.11.20
申请人 Infineon Technologies AG 发明人 Meyer Thorsten;Gruber Martin;Schaller Rainer Markus;Jost Franz;Mieslinger Stefan;Chen Liu;Salminen Toni;Babulano Giuliano Angelo;Oetjen Jens;Dinkel Markus
分类号 H01L43/02;G01R33/09;G01R33/07;H01L43/06;H01L43/08 主分类号 H01L43/02
代理机构 代理人
主权项 1. A semiconductor package, comprising: a semiconductor die attached to a substrate; and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway, the magnetic field sensor comprising: a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component n a first direction; anda second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.
地址 Neubiberg DE