| 摘要 |
PROBLEM TO BE SOLVED: To easily handle even a wafer which is formed thin during machining. SOLUTION: An annular protection member 12 is joined in an outer peripheral excessive area on the surface of the wafer W where no device is formed, and the top surface side is held in this state to grind the reverse surface Wb. The outer periphery is reinforced with the annular protection member 12, so the wafer is easy to handle even after being ground thin. COPYRIGHT: (C)2006,JPO&NCIPI |
