METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To straighten a warped cupper base 3 due to the linear expansion coefficient difference between the cupper base 1 and an insulation substrate 3 when the base 1 is soldered to the substrate 3. SOLUTION: The backside outer periphery of a cupper base 1 is supported and a semiconductor chip mounting surface of an insulation substrate 3 is hermetically covered to form a closed space, the cupper base 1 and the substrate 3 are heated up to a temperature enough to creep and deform solder, the pressure in the hermetic space is increased to exerta pushing force on the cupper base 1 and the substrate 3 outwards from inside the hermetic space, thereby straightening the base 1 and the insulation substrate 3 into a desired shape owing to the pushing force. COPYRIGHT: (C)2006,JPO&NCIPI