| 摘要 |
A first sub-table, a second sub-table, a rubber plate, and a metallic plate are structured in a layer form as a substrate- processing table. The substrate-processing table has substrate adsorption holes for sucking a substrate, penetrating through the sub- tables, the rubber plate, and the metallic plate. The substrate- processing table further has hard sheet adsorption holes for sucking the metallic plate, penetrating through the second sub-table and the rubber plate. In fixing the substrate, air is discharged through a cavity formed in the lower part of the second sub-table to make the pressure in the adsorption holes negative. The structure described above improves a method of holding a substrate and enhances a scribing function in a scribing process when the substrate is divided and a breaking function in a breaking process.
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