| 发明名称 |
CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE |
| 摘要 |
A method of manufacturing a bond pad structure may include depositing an aluminum-copper (Al—Cu) layer over a dielectric layer; and depositing an aluminum-chromium (Al—Cr) layer directly over the Al—Cu layer. |
| 申请公布号 |
US2016379948(A1) |
申请公布日期 |
2016.12.29 |
| 申请号 |
US201514752115 |
申请日期 |
2015.06.26 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ARVIN Charles L.;GAMBINO Jeffrey P.;MUSANTE Charles F.;MUZZY Christopher D.;SAUTER Wolfgang |
| 分类号 |
H01L23/00;C22C21/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a bond pad structure comprising:
depositing an aluminum-copper (Al—Cu) layer over a dielectric layer; and depositing an aluminum-chromium (Al—Cr) layer directly over the Al—Cu layer. |
| 地址 |
Armonk NY US |
