| 发明名称 |
HEAT ISOLATION STRUCTURES FOR HIGH BANDWIDTH INTERCONNECTS |
| 摘要 |
A die interconnect system having a plurality of connection pads, a heat generating element thermally isolated from the die, one or more leads extending from the die to the heat generating element, each lead having a metal core with a core diameter, a dielectric layer surrounding the metal core with a dielectric thickness, and an outer metal layer attached to ground, wherein one or more leads are exposed to ambient conditions and/or are convectively or contact cooled for at least a portion of their length to minimize heat transfer from the heat generating element to the die. |
| 申请公布号 |
US2016379911(A1) |
申请公布日期 |
2016.12.29 |
| 申请号 |
US201414902171 |
申请日期 |
2014.07.02 |
| 申请人 |
ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG |
发明人 |
Cahili Sean S.;Sanjuan Eric A. |
| 分类号 |
H01L23/367;H01S5/024;H01L25/16;H01S5/022;H01L23/00;H01L23/373 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A die interconnect system, comprising:
a die having a plurality of connection pads; a heat generating element thermally isolated from the die; more than one lead extending from the die to the heat generating element, each lead having a metal core with a core diameter, a dielectric layer surrounding the metal core with a dielectric thickness, the dielectric layer being covered with an outer metal layer attached to ground, wherein more than one lead is exposed to ambient conditions and/or is convectively or contact cooled for at least a portion of its length to minimize heat transfer from the heat generating element to the die. |
| 地址 |
Fridolfing DE |
