| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability in connection between the top surface of a metal bump and a wiring layer connected thereto, to improve yield of a wiring board, the wiring board using the metal bump as an interlayer connection means, and further to enhance electrical characteristics by enhancing an insulating part between wiring layers or between wiring boards. SOLUTION: The top surface of a metal bump 28 and a wiring film 10 (16) connected thereto are connected by direct metal bonding of metals, for example, copper-to-copper bonding. Furthermore, air or a foamed resin 12 containing air is used as an interlayer insulating film, Thus, reliability in the connection between the top surface of the metal bump and the wiring layer is improved, and yield of a wiring board can be enhanced. When interlayer insulation using air or the foamed resin is desired, the dielectric constant of an interlayer insulator is reduced to lower parasitic capacitance of the wiring circuit board or an electronic circuit using the same, thereby improving circuit characteristics and performance. COPYRIGHT: (C)2006,JPO&NCIPI |
