| 摘要 |
PROBLEM TO BE SOLVED: To reduce thermal damage of a circuit board, when removing a solder remaining on the circuit board during repair work for a BGA/CSP package. SOLUTION: The suction jig wherein a suction part 1, having a solder suction hole 3, is provided is heated and it is brought into contact with the circuit board, as it is, and the solder is sucked by capillary effect, while the solder remaining on the circuit board is melted. In this case, the solder suction jig is heated amply, and the solder is sucked for a short time, thus reducing thermal damages to the circuit board. COPYRIGHT: (C)2006,JPO&NCIPI |
