INJECTION COMPRESSION MOLDING METHOD OF CONDUCTIVE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a method of molding an excellently conductive structure of good dimensional precision without a skin layer in a short molding cycle at a low cost. SOLUTION: The injection compression molding method of the conductive structure composed of a conductive filler-containing thermoplastic resin composite material showing volume resistivity of not more than 100 mΩcm comprises a mold having a cavity for forming mold wall surface covered with a heat insulating layer made of a heat insulating material having a thermal conductivity of not more than 0.017 J/cm×sec×°C as a mold of the injection compression molding. COPYRIGHT: (C)2006,JPO&NCIPI