| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which can be reduced in size and thickness. SOLUTION: The semiconductor package (1) comprises a substrate (10), a first circuit pattern (11) provided over the upper surface of the substrate (10), a semiconductor chip (12) provided over the first circuit pattern (11), a rid (15) bonded on the substrate (10) by covering the semiconductor chip (12) and forming a hollow part (14) against the substrate (10), and a second circuit pattern (16) provided at the internal surface (15a) of the rid (15). Moreover, at least part (16a) of the second circuit pattern (16) is electrically connected with at least part (11a) of the first circuit pattern (11). COPYRIGHT: (C)2006,JPO&NCIPI
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