| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thin type magnetic disk drive which has high reliability and a large storage capacity. SOLUTION: A side space 102 for mounting electronic components is arranged at the side of a disk enclosure part 101. Tall chip components are intensively mounted in the space 102, and the other short chip components are mounted in a dig part on the back of the disk enclosure 101. Therefore, in each area of a circuit substrate 103, the chip components can be mounted selectively according to the heights of the chip components, and as a result, thickness reduction becomes possible without decreasing rigidity of the magnetic disk device. COPYRIGHT: (C)2006,JPO&NCIPI
|
