| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste composition which can assure sufficient substrate reliability for a moisture absorption reflow thermal resistance, a resistance value, etc. even when a crystalline thermoplastic resin is used for an inner layer, an outer layer and conductor wiring of a via hole in a batch multilayer interconnection substrate using a crystalline thermoplastic resin for an insulation base material, in a heat curing type conductive paste composition used for the multilayer interconnection substrate. SOLUTION: The conductive paste composition for the multilayer interconnection substrate is used for the multilayer interconnection substrate obtained by batch laminating the interconnection substrate containing a conductive paste composition on the front surface of an insulating base material obtained from a crystalline thermoplastic resin composition and in the via hole by heat fusion bonding. The conductive paste composition contains a conductive powder, and an additional type thermosetting imido monomer. The curing peak temperature of a polyimide induced from the additional type thermosetting imido monomer is the glass transition temperature (Tg) minus 15°C of the crystalline thermoplastic resin composition to lower than the crystallization peak temperature (Tc). COPYRIGHT: (C)2006,JPO&NCIPI |
