| 摘要 |
PROBLEM TO BE SOLVED: To protect a glass substrate against damage and to prevent a gap from being formed between the glass substrate and a conductive metal when vias are formed on the glass substrate which is attached to the surface of a wafer so as to protect a device. SOLUTION: Anchor metal films 3 are formed on inner surfaces of the capillaries which penetrate through the glass substrate 1 from the front surface 1a to the rear surface 1b, and cavities formed on internal peripheral side of the anchor metal films 3 are filled with brazing materials 7 to form vias 8. The anchor metal film 3 is set lower in the coefficient of thermal expansion than the brazing material 7, whereby the glass substrate 1 can be protected against damage caused by a thermal expansion coefficient difference between the glass substrate 1 and the brazing material 7. COPYRIGHT: (C)2006,JPO&NCIPI
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