| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a sealing member and a plastic substrate are tightly stuck. SOLUTION: The semiconductor device includes a plastic substrate 1 of a multilayer structure provided with a plurality of wiring, a semiconductor chip 2 having a plurality of electrodes connected to the plurality of wiring using a soldering material, and a sealing member 8 made of sealing resin which makes the semiconductor chip stick to the plastic substrate. A metal plane layer 9 is formed in the plastic substrate. COPYRIGHT: (C)2006,JPO&NCIPI
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