发明名称 SAW FILTER PACKAGE
摘要 PROBLEM TO BE SOLVED: To fully increase the amount of attenuation caused by a change in a formed attenuation pole not only in a high-band attenuation band, but also in a low-band one regardless of a miniaturized configuration. SOLUTION: An SAW filter package comprises a piezoelectric substrate on which a first SAW resonator connected between first and second nodes, a second SAW resonator connected between the first and third nodes, and a third SAW resonator connected between the second and fourth nodes are formed; a package having a plurality of electrodes and mounting the piezoelectric substrate; a first wire connected between the third and fourth nodes; and a second wire connected between the electrode to which a ground voltage is supplied in the electrodes, and the third node. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006060871(A) 申请公布日期 2006.03.02
申请号 JP20050311683 申请日期 2005.10.26
申请人 OKI ELECTRIC IND CO LTD 发明人 TERADA SATOSHI;NOGUCHI KAZUSHIGE;KOMAZAKI TOMOKAZU;KIHARA YOSHIICHI;FUJITA YOSHIAKI
分类号 H03H9/25;H03H9/64 主分类号 H03H9/25
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